Huntsville, Alabama, June 21, 2006 – AGI Corporation, manufacturer of Wave Solder and SMT / Reflow Pallets, Wave Solder Profiling Tools and Feeder Storage Carts, announced today that it is producing titanium selective solder pallets for difficult wave soldering applications. These applications include PCB’s that are designed with plated through hole components in very close proximity to bottom side SMD’s. By machining titanium vs. composites we can achieve ‘seal walls’ down to .020 inches thick standard and as small as .015 inches thick over short distances. Other benefits include; no sagging during soldering and thinner floor thickness which reduces the “Z” height the solder must travel.

AGI Corp’s design is based upon machining a single piece of titanium to match the PCB and incorporate that into a composite pallet frame. By doing this, the pallet is lighter, cheaper to machine and by avoiding using small titanium inserts screwed to the pallet; we avoid the issues of leaking, alignment and thermal mismatch. The composite frame runs much cooler than the titanium coming out of the wave, so it is easier to handle or convey after soldering. The titanium pallet design includes many of the proven AGI designs for low defect wave soldering.

According to general manager, Chad Petty, “AGI Corp is very excited about the introduction of this new product. This solution addresses the special needs of challenging applications. If you have any questions about what AGI Corp can do for you please feel free to contact us. Our manufacturing operations are now producing products for North America and Mexico, 7 days per week, allowing AGI to supply customers with quality products as quickly as possible.”