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DEK Diode Pumped Fiber Laser |
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Processing Speed
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Stencils up to 28000 apertures/Hr
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Processing Speed
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Wafer bumping up to 45000 apertures/Hr
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Axis travel
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up to 610x830 (mm)
makes 23x27” remountable foils in one process
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Material thickness capability
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Up to 0.6mm (stainless)
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Maximum speed
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3M/s
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Resolution
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0.01 Microns
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Repeatability
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0.5 Microns
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Laser
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150W air cooled Fiber
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Max Frame size
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29” x 34”
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Motion system
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Linear motor gantry with glass scales
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Assist gas
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Compressed air
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Analysis and Photos courtesy of Nextek Inc., Madison, AL
For more information on Nextek’s services please visit www.Nextekinc.com
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